<\/span><\/h2>\nSi3<\/sub>N4<\/sub>\u00a0has a good thermal shock resistance along with\u00a0a low thermal expansion coefficient. Such properties bring Si3<\/sub>N4<\/sub>\u00a0ceramics the ability to resist cracks under intense temperature fluctuations. Si3<\/sub>N4<\/sub>\u00a0is also not easily react with molten metals, ensuring stable usage.<\/p>\nLimitation: <\/b><\/strong>In the oxidizing atmospheres, the high-temperature tolerance of Si3<\/sub>N4<\/sub>\u00a0is limited. Si3<\/sub>N4<\/sub>\u00a0has a disadvantage that is higher production costs, due to its relatively long manufacturing cycle.<\/p>\nApplications: <\/b><\/strong>Si3<\/sub>N4<\/sub>\u00a0ceramic material is popular in high-temperature reducing atmospheres\u00a0in your industries. It is used in gas turbine blades, continuous casting molds for the metallurgy,\u00a0and ceramic bearings.<\/p>\n<\/span>Aluminum Nitride (AlN) <\/b><\/strong>–<\/b><\/strong>\u00a01400<\/b><\/strong>\u2103<\/b><\/strong><\/span><\/h2>\nAluminum nitride possesses exceptional thermal conductivity approaching that of metals. It also maintains excellent electrical insulation. With high-temperature stability, it is perfectly suited for the dual requirements of heat dissipation and insulation in electronic devices.<\/p>\n
Limitation: <\/b><\/strong>It has relatively weak mechanical impact resistance and is susceptible to corrosion at high temperatures.<\/p>\nApplications: <\/b><\/strong>Aluminum nitride is a common high-temperature electronic ceramic material. It is widely applied in high-temperature packaging substrates for your semiconductor chips, high-temperature heat dissipation components for\u00a0your\u00a0LEDs, and linings for your high-temperature vacuum furnaces.<\/p>\n<\/span>Mullite (3Al<\/b><\/strong>2<\/b><\/sub><\/strong>O<\/b><\/strong>