Boron Nitride Sputtering Target Manufacturer for High-Precision Custom Requirements
Newthink’s boron nitride sputtering targets are suitable for both chemical vapor deposition (CVD) and physical vapor deposition (PVD) applications. Our boron nitride ceramic products have excellent electrical insulation, high thermal conductivity and chemical inertness to ensure consistent and efficient sputtering. Manufactured with high purity (≥99.5%) and density, our boron nitride targets are specially designed to be compatible with radio frequency (RF) and reactive radio frequency (RF-R) sputtering methods, with a maximum power density of up to 20 watts per square inch. Achieve exceptional results and extend product life with Newthink’s precision-engineered solutions.
Boron Nitride Sputtering Target for Various Industries
Newthink can provide boron nitride sputtering targets of different shapes, sizes and processes, which can be applied to various industries.
Semiconductor ManufacturingCubic boron nitride (c-BN) thin films can be deposited, crucial for high-temperature and high-frequency device applications.
Optical CoatingHigh transparency and can be utilized as an anti-reflection film of optical devices, enhancing durability, low friction, and wear resistance.
High-temperature CoatingBoron nitride sputtering targets possess excellent oxidation and corrosion resistance, thus are well applicable in high-temperature industrial equipment.
Electronic Device PackagingActs as a very good heat dissipation material, prolonging the life of electronic components by enhancing thermal management.
Features and Applications of Boron Nitride Sputtering Target
Boron nitride sputtering target is a refractory compound comprised of boron and nitrogen and possesses excellent thermal and chemical stability. The main characteristics and applications of boron nitride sputtering target are as given below.
Purity ≥99.5%, high purity for stable and reliable performance in precision thin-film
Thermal conductivity can be 300-400 W/(m・K) (hexagonal boron nitride), with good heat dissipation.
Withstand acids, alkalis and most corrosive gases (e.g., Cl2 and O2), ideal for the preparation of protective coatings in severe working conditions.
The hardness of cubic boron nitride ranks next to diamond (microhardness up to 45-50 GPa) and has superior wear resistance.
Applicable to conventional radio frequency (RF) and reactive radio frequency (RF-R) sputtering techniques, offering versatility for many types of depositions.
The resistivity is higher than 1012 Ω・cm at room temperature, making it an ideal high-frequency insulation material.
Meets the light transmittance requirements of precision optical devices, delivering clarity and performance in optical coatings.
Boron nitride sputtering targets have a high melting point and can keep the structure stable at temperatures above 2000℃.
Why Choose Newthink Boron Nitride Sputtering Target?
Choosing Newthink means choosing dependable, consistent quality. We offer accurate thin-film deposition solutions that are designed to fit your particular application.
Versatile preparation of hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN) films for flexibility in applications in diverse industries.
Boron nitride sputtering target purity is ≥99.5%, and the content of impurities is less than the industry average.
Small batch samples can be delivered within 3-7 days.
Being ISO certified, we strictly oversee every process, ensuring each target meets the highest standards of quality and dependability.
Each product will have strict size inspection before packaging.
We can provide semiconductor-grade ultra-clean cleaning process to avoid particle contamination from the source.
Boron Nitride Sputtering Target Production Workshop
Newthink boron nitride sputtering targets are produced by a precision process, which utilizes advanced melting technology for creating high-performance boron nitride powder up to 99.9% purit for the best density and microstructure in the target. Each of the boron nitride sputtering targets is cleaned carefully before shipment to eliminate any surface contamination and then vacuum-packed in a plastic bag with a moisture barrier. Newthink is commited to providing high-performance sputtering targets that will upgrade your deposition process and provide you with excellent results.
Common Custom Sizes and Shapes of Boron Nitride Sputtering Target
Below are our popular Boron Nitride sputtering targets in custom sizes and shapes.
Shapes: Boron nitride sputtering targets can be customized into various shapes such as round, square, and ring.
Sizes: Common custom sizes include
Round: Φ1.0″, Φ2.0″, Φ3.0″, Φ4.0″, Φ5.0″, Φ6.0″, up to 21 inches in diameter, thickness ≥1 mm.
Square: 5″ x 12″, 5″ x 15″, 5″ x 20″, 5″ x 22″, 6″ x 20″, thickness ≥1 mm, length ≤ 32 inches, width ≤ 12 inches.
Parameters for Different Types of Boron Nitride Sputtering Target
Boron nitride sputtering targets have a variety of processes, the main properties are as follows:
- Datasheet
| Parameter | Value | Remarks |
| Material Type | Boron Nitride | White, Crystalline Solid |
| Purity | ≥99.5% (standard), 99.5%-99.9% (high purity) | Purity can be customized for specific applications |
| Density | 2.2 – 2.3 g/cm³ | Ensures efficient sputtering performance |
| Melting Point | maintain structural stability at temperatures exceeding 2000℃ | High thermal stability for high-temperature applications |
| Hardness (Cubic BN) | 45-50 GPa | Ultra-high hardness, second only to diamond |
| Thermal Conductivity (h-BN) | 300-400 W/(m·K) | High heat dissipation, ideal for thermal management |
| Electrical Resistivity | > 10¹² Ω·cm | Excellent electrical insulation properties |
| Chemical Stability | Excellent resistance to acids, alkalis, and corrosive gases (Cl₂, O₂, etc.) | Suitable for harsh environments and chemical processing |
| Thickness Range | 5-80 mm (customizable) | Standard targets typically range from 5-10 mm; can be tailored to requirements |
| Size & Shape | Customizable (round, square, or specific shapes based on requirements) | Achieved via diamond cutting, laser micromachining, or powder metallurgy |
| Sputtering Methods | RF, Reactive RF (RF-R) | Compatible with various sputtering techniques |
| Contamination Control | Ultra-cleaning process, vacuum-sealed with moisture barrier | Ensures particle-free delivery for sensitive applications |
| Applications | Semiconductor (MOSFETs, LED substrates), medical devices, high-temperature coatings, energy storage products | Versatile use in electronics, medical, and energy sectors |
Related Products
Silicon Carbide (SiC) Sputtering TargetApplied in heat dissipation layer, substrate of LED and high temperature wear-resistant coating of power semiconductor devices.
Alumina (Al₂O₃) Sputtering TargetHigh insulation (resistivity > 10¹⁴ Ω・cm) and chemical inertness enhance boron nitride’s high and low temperature properties.
Aluminum Nitride (AlN) Sputtering TargetWith high thermal conductivity and good insulation, it is the material of choice for high-temperature electronics and semiconductor thermal management.
Cubic Boron Nitride (c-BN) Sputtering TargetIt boats high hardness and can be used in ultra-wear-resistant applications where boron nitride cannot suffice.
Our Boron Nitride sputtering targets are with a minimum purity of 99.5%. We can provide higher purity (99.5-99.9%) ones produced by hot pressing or hot isostatic pressing for special applications where ultra-low impurities are needed, with impurities (like O, C, etc.) controlled in ppm level.
The thickness of sputtering targets is different by application. For instance, 5-10 mm targets are commonly used for semiconductor production, industrial copper targets can be up to 80 mm in thickness, and composite targets (e.g., metal-ceramic laminates) have a thickness based on the design of the structure, and typically 10-30 mm, considering thermal conductivity and insulation. We can provide the thickness as per your requirement.
Yes, the shape and size of our Boron Nitride sputtering targets can be customized. We can supply customers with standard size and shape, like round, square, etc., and we can also provide custom manufacturing, which can be done by diamond cutting, laser micromachining or powder metallurgy mold customization according to your specific size needs.
Boron nitride sputtering targets are mainly used in the semiconductor and electronic information fields, such as depositing boron nitride insulating layers (for MOSFET devices, deep ultraviolet LED substrates), preparing dielectric films for high-frequency devices; in the field of special coatings, they provide ultra-hard (hardness up to 40GPa) and low friction coefficient boron nitride film solutions for medical devices (such as surgical knives) and precision molds; in integrated circuit manufacturing, they are used as high-purity insulating dielectric layer materials (such as interlayer insulation for advanced process chips); in the field of new energy, they play the advantages of high chemical stability in solid-state battery electrolyte interface layers and hydrogen fuel cell proton exchange membrane coatings, etc.
